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1.Cut
to Size, Issue
¡ïInner layer/Core shearing
2.Image Transfer/Etching(Inner layer)
¡ïInner layer circuit manufacturing
¡ïUse dry film as etching resist
3.AOI/Test
¡ïAOI(Automatic Optical Inspection)in place of visual
inspection
¡ïFine circuit pattern inspection
4.Lamination
¡ïCopper foil + prepreg + inner layer(thin core)
¡ïHigh temperature pressure plus bacuum laminate
5.Drilling
¡ïWith broken & missed drill bit detector
¡ïDrilling program down load directly from CAD/CAM data
6.Plate Through Hole/Panel Plating
¡ïPlated to required thickness
¡ïConnected conductivity between layer to layer
7.Image Transfer (Outer Layer)
¡ïUse automated exposure machine to transfer image from dry
film to laminate surface
¡ïExpose circuit pattern for plating: dry film cover etching
areas as plating resist
8.Pattern Plating
¡ïPlate 1.0 mil thick Cu
¡ïPlate 0.3 mil thick tin as etching resist
9.Dry Film Stripping/Etching/Solder Stripping |
¡ïStrip dry film then etch copper area covered by dry film
¡ïStrip Tin on circuit pattern
10.Open/Short
Test
¡ïTest program down load from CAD/CAM data through network
system
¡ïTest all point to point and isolated patterns function
11.Solder mask
¡ïLPI(Liquid Photo Imagable)which are UL approved
12.Electroless
Nickel/Gold
¡ïElectroless Nickel & Immersion Gold On Copper
13.Gold
Tab Plating
¡ïAutomated Gold Tab Plating (0125-1.5 MICRON) thickness
14.Hot
Air Leveling(HAL)
¡ïHorizontal HAL processing to get solder flatness of SMD pad
better and smoothness
15.Outline
Finish
¡ïCNC routing /punch
¡ïV-cut
¡ïEdge connector chamfer(20-45 angular)
16.Final
Test
¡ïHigh voltage 300 VDC OHM double sided test
17.Organic
Coatcis
¡ïorganic Coating on Copper
18.Packing
¡ïVacuum or popular type |
